| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface grinding device capable of relieving damages to a work when abnormal processing states including the dulling of a grinding wheel and fall-out of a large amount of abrasive grain occurs in a surface grinding device for a work made of hard/brittle material including silicon wafer. SOLUTION: A grinding wheel 2 is connected to a grinding wheel spindle 4 by a wheel flange 3 through an electrorestrictive element or magnetorestrictive element 10. When a grinding wheel spindle load current value i reaches a predetermined reference value e or more while grinding, the electrorestrictive element or magnetorestrictive element 10 connected to the grinding wheel spindle 4 is instantly started and the grinding wheel spindle 4 is raised by 10-20μm to the notching counterdirection of the grinding wheel spindle 4 so as to evacuate the grinding wheel 2. COPYRIGHT: (C)2006,JPO&NCIPI
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