Stress-free encapsulation of inserts, in particular electrical components, in a plastic housing, involves coating insert in material with different thermal expansion coefficient to those of insert and housing plastic

摘要

An insert(210) made of a material with a thermal expansion coefficient is at least partly encapsulated in a plastic housing(200) of a material with a different thermal expansion coefficient. To reduce stress fractures induced by different expansion rates (210) has a coating(220) of a different material with a thermal expansion different to those of (200) and (210). An independent claim is included for a plastic housing around at least one insert which has a coating with a different thermal expansion rate to that of the plastic housing and insert materials.