| 摘要 |
PROBLEM TO BE SOLVED: To improve adhesiveness of metallic nuclei to the surface of a substrate while affecting a substrate material little, by reducing a metallic complex carried on the surface of the substrate at a low temperature with a reducing agent to form the metallic nuclei containing no thermal decomposition residue on the surface of the substrate. SOLUTION: This pretreatment method comprises the steps of: first, contacting the substrate 11 with a subcritical fluid or a supercritical fluid having the metallic complex 12 containing the same metal as a plating metal dissolved therein to degrease and etch the surface of the substrate 11, and at the same time, to make the surface of the substrate 11 carry the metallic complex 12; and next, reducing the metallic complex 12 carried on the surface of the substrate 11 with the use of the reducing agent, and thereby depositing the metal in the metallic complex 12 on the surface of the substrate 11 to form the metallic nuclei 13 on it. COPYRIGHT: (C)2006,JPO&NCIPI
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