METHOD OF MANUFACTURING INTEGRATED-CIRCUIT CHIP FOR MULTI-CHIP PACKAGE, AND WAFER AND CHIP FORMED BY THE METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing integrated-circuit chips for a multi-chip package which can simplify the manufacturing process and reduce the manufacturing cost and process time.

SOLUTION: The integrated-circuit chip comprises a semiconductor substrate, having upper and lower surfaces which extend to outer edges and having at least one first contact pad on the upper surface contiguous to the outer edge, an electrically insulating region which is formed on the outer edge side of the semiconductor substrate and in which a through hole is formed, and a contact electrode that fills the through hole and is electrically connected to the first contact pad.

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