| 摘要 |
An epoxy resin composition is disclosed which contains an epoxy resin and a polyphenylene ether having a number-average molecular weight of 1, 000-4,000 wherein a component having a molecular weight of not less than 20,000 is substantially included in an amount of 20% or less. An epoxidized polyphenylene ether resin is further disclosed which is obtained by reacting a phenolic hydroxyl group of a polyphenylene ether having a number-average molecular weight of 1,000-4,000 with an epoxy group of an epoxy compound or an epoxy resin.
|
