发明名称 |
Thermal insulation for electronic devices |
摘要 |
Methods and devices for insulating electronic devices are disclosed. The devices include a jacket comprising an absorbing material wetted with a liquid cooling-agent. When the jacket is introduced into a heated process-environment, the liquid cooling-agent evaporates and cools the jacket. The absorbing material can comprise a heat-resistant, organic, polymeric material, such as a network of polyimide fibers.
|
申请公布号 |
US6993927(B2) |
申请公布日期 |
2006.02.07 |
申请号 |
US20040759805 |
申请日期 |
2004.01.15 |
申请人 |
ELECTRONIC CONTROLS DESIGN, INC. |
发明人 |
AUSTEN PAUL M.;BREUNSBACH REX L. |
分类号 |
F25D23/12;F25D7/00;F28D5/00 |
主分类号 |
F25D23/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|