| 摘要 |
<p>PURPOSE: A semiconductor package and a manufacturing method thereof are provided to manufacture a thin semiconductor package by offsetting the thickness of the first semiconductor chip by the thickness of a substrate like a lead or circuit board, and to improve a heat radiation capacity by exposing one surface of the first and/or second semiconductor chips to the exterior of an encapsulating material. CONSTITUTION: A plurality of input/output pads(4) are formed in the center of the second surface and in the inner circumference of the first semiconductor chip(2), including the first and second surfaces(2a,2b). The second semiconductor chip(6) has the first and second surfaces(6a,6b). A plurality of input/output pads(8) are formed on the first surface of the second semiconductor chip having the first and second surfaces, connected to the input/output pads formed in the center of the first semiconductor chip by using the first electrical connection unit. The substrate has the first and second surfaces in the outer circumference of the first semiconductor chip, connected to the input/output pads formed in the inner circumference of the first semiconductor chip by using the second electrical connection unit. The encapsulating material(40) encapsulates the first semiconductor chip, the second semiconductor chip, the first electrical connection unit, the second electrical connection unit and the substrate.</p> |
