| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide the mount structure of a solid-state electrolytic capacitor on a printed circuit board 5 by means of a reduced space so as to attain downsizing and weight reduction. <P>SOLUTION: In the mount structure of the solid-state electrolytic capacitor onto the printed circuit board, a capacitor element 1 comprises a chip 2 made of valve action metallic powder, an anode rod 3 projected from one end face of the chip, and a cathode film 4 formed on the surface of the chip. A thickness T0 in a direction at a right angle to the axial line of the anode rod is made almost equal to or less than a plate thickness T of the printed circuit board, a cutout hole 10 is cut in the printed circuit board 5 in a way that through-holes 8, 9 provided to be electrically conductive to a pair of wiring patterns 6, 7 on the surface of the printed circuit board 5 are exposed in the cutout hole 10, and the capacitor element is loaded into the cutout hole so that the anode rod and the cathode film are electrically connected to the through-holes. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
