| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for semiconductor sealing, which controls bad conditions of void occurrence by formation of unpacked parts of a sealing material. SOLUTION: The epoxy resin composition for semiconductor sealing comprises (A) an epoxy resin, (B) a curing agent, (C) a curing promoter, (D) an inorganic filler and (E) a sublimable substance. The content of the component (E) is adjusted to 0.1-1.0 wt.% in the epoxy resin composition. COPYRIGHT: (C)2006,JPO&NCIPI
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