| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus which is capable of a sequential process of eliminating foreign matters sticking to the back surface of a wafer, which is composed of a semiconductor, a glass, a board, and a resin, or of the board, and has a function of offering an optimum effect in eliminating the foreign matters, in response to the amount or size of the foreign matters sticking to the wafer or board, thus minimizes the required processing time per wafer or substrate. SOLUTION: The board is arranged to be attracted to electrostatic chucks via a resin sheet, capable of capturing foreign matters so that the resin sheet captures the foreign matters sticking to the back surface of the board. The resin sheet is rolled so as to be supplied in sequence for each board, and a piece of resin sheet used up in capturing the foreign matters is rolled to be recovered. When the entire roll of resin sheet is used up, it is scrapped and a new one is provided. COPYRIGHT: (C)2006,JPO&NCIPI |
