发明名称 DEVICE AND METHOD FOR MOLDING MOLDED COIL COMPONENT
摘要 PROBLEM TO BE SOLVED: To decrease a pressure loss of a resin material having a simple structure to adequately fill the resin material at a relatively low-filling pressure, surely sealing a coil. SOLUTION: A molding device of a molded coil component M comprises molds 1, 2 provided openably, and a molding machine 3 for injecting a resin material to the molds 1, 2. A cavity 4 is formed at the contact face of the closed molds 1, 2, and a resin material, delivering-path 5 for delivering the resin material from the molding machine 3 to the cavity, is formed. The cavity 4 is formed into a shape capable of housing a coil 7 wound around a core 6. Coil-end molded parts 4a, 4a are formed at the part with the both coil-ends 7a, 7a arranged respectively. A plurality of gates 9, 9 ... for communicating from the resin material delivering path 5 to the cavity 4 are formed at the both coil-end molded parts 4a, 4a so as to open correspoding to each core 6, 6 .... COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006032847(A) 申请公布日期 2006.02.02
申请号 JP20040213242 申请日期 2004.07.21
申请人 TOYOTA MOTOR CORP 发明人 ASAI MASATAKA
分类号 H01F41/12 主分类号 H01F41/12
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