| 摘要 |
PROBLEM TO BE SOLVED: To dispose a number of substrate regions on mother boards with high density by preventing spread of a sealant when substrates are stuck to each other. SOLUTION: A mother board 111a including a plurality of substrate regions each to be a front side substrate of a liquid crystal apparatus and a mother board 111b including a plurality of substrate regions each to be a rear side substrate are prepared and an annular partition 10 having height nearly equal to the gap between the substrates is formed at edge sides of each substrate region of at least one of the mother boards 111a and 111b. An annular groove H along the outer circumference of the substrate region is formed at the partition 10. The sealant 6a is applied in the groove of the partition 10 and the mother boards 111a and 111b are stuck to each other via the sealant 6a. Since the partition 10 is formed on both sides in a width direction of the sealant 6a in this method, the sealant 6a never invades into a display region and never interferes with the sealant 6a in an adjacent substrate region. Thereby, the substrate regions can be densely disposed as compared with conventional ones. COPYRIGHT: (C)2006,JPO&NCIPI
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