发明名称 ALIGNING METHOD FOR SUBSTRATE TO BE MACHINED, ITS DEVICE AND MARKING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an aligning method for reducing production cost by enhancing productivity without lowering line efficiency. SOLUTION: This aligning method is provided in a manufacturing line for continuously carrying a substrate to be machined. In the method, the supply of the substrate to be machined to an aligning part is detected, the substrate is carried at higher speed than speed in the manufacturing line according to a signal from a detection means, and the substrate is aligned in a fixing part. Subsequently, the fixing of the substrate is released. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006027875(A) 申请公布日期 2006.02.02
申请号 JP20040212676 申请日期 2004.07.21
申请人 TOPPAN PRINTING CO LTD 发明人 SUNOCHI ATSUSHI;ITO KATSUMI;YAMATO SHINICHI;SASAKI MASAHIRO
分类号 B65G47/88 主分类号 B65G47/88
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