| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device to which a semiconductor element and an insulating substrate are fixed by using adhesive for controlling the leakage/widening of the adhesive, and for improving the adhesiveness of the semiconductor and the insulating substrate. SOLUTION: This semiconductor device is provided with a semiconductor element 11, an insulating substrate 18 to which the semiconductor element is fixed by using thermosetting adhesive 16, a plurality of electrode pads arranged on the circuit formation face of the semiconductor element 11, a wire for electrically connecting the electrodes with an external terminal on the insulating substrate and sealing resin for sealing the semiconductor element and wire fixed on the insulating substrate. Adhesive 14 in a semi-cured status formed in the whole periphery of the external peripheral end face of the semiconductor element is thermoset with the thermosetting adhesive 16, and integrally formed with the thermosetting adhesive in the external periphery of the semiconductor element fixed on an insulating substrate 18. COPYRIGHT: (C)2006,JPO&NCIPI |
