发明名称 Conductive paste
摘要 Provided is a conductive paste which can have high conductivity even if the sintering temperature is 500° C. or less, and which does not cause an interference pattern or crack on a substrate even if a thick film thereof is formed on the substrate. The conductive paste comprises main components including a metal powder, a glass frit, and an organic vehicle. The metal powder is composed of spherical particles (A) having an average primary-particle diameter of 0.1 to 1 mum and spherical particles (B) having an average primary-particle diameter of 50 nm or less, and the content of spherical particles (A) ranges from 50 to 99 wt % and the content of spherical particles (B) ranges from 1 to 50 wt %. The content of the glass frit ranges from 0.1 wt % to 15 wt % to the total amount of the glass frit and the metal powder. Preferably, the glass frit does not contain lead and has a working point of 500° C. or less, and the average particle diameter thereof is 2 mum or less. The present invention can widely be applied to print on a substrate and sinter so as to form an electric circuit on the substrate.
申请公布号 US2006022173(A1) 申请公布日期 2006.02.02
申请号 US20050531697 申请日期 2005.04.18
申请人 YAMAKAWA MASAHIRO;SHIMODA KOHEJ 发明人 YAMAKAWA MASAHIRO;SHIMODA KOHEJ
分类号 H01B1/12;H01B1/00;H01B1/22;H05K1/09 主分类号 H01B1/12
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