| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing device capable of suitably evaluating surface density of an abrasive grain buried in a polishing surface of a surface plate. <P>SOLUTION: The device is a polishing device having the surface plate 21 for placing an object to be polished at polishing; a member 41 having a surface parallel to the polishing surface of the surface plate; a slurry feeding means 109 for feeding the slurry containing the abrasive grain to the polishing surface and means 104, 103 for irradiating the polishing surface with a light; and a means 104 for analyzing intensity variation of Raman scattering light from the polishing surface. The slurry containing the abrasive grain is added dropwise onto the surface plate used for the polishing device and the member having the surface parallel to the polishing surface of the surface plate and the surface plate are relatively moved. The polishing surface is irradiated with a light and a dropwise addition of slurry is adjusted according to intensity variation of Raman scattering light from the polishing surface. Thereby, the surface plate in which the abrasive grain is buried in the polishing surface at a predetermined surface density can be prepared. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
