| 摘要 |
PROBLEM TO BE SOLVED: To suppress flowing out of build-up resin upon formation of a build-up resin layer, form the build-up resin layer having superior surface layer smoothness, secure smoothness of a surface layer conductor pattern formed on the build-up resin layer, and increase electrical reliability of the surface layer conductor layer or the mountability of a flip-chip, in a partial build-up wiring circuit board. SOLUTION: A framed build-up resin film 16, having a rigid frame member 14 surrounding the outer periphery of a lamellar build-up resin 15 of the same planar shape as a build-up resin layer formation region set on a printed wiring plate 20 is laminated and pressed on the build-up resin layer forming region of the printed wiring plate 20. Thereafter, the rigid frame member 14 is removed to form a build-up resin layer 27 made of the lamellar build-up resin 15. COPYRIGHT: (C)2006,JPO&NCIPI |
