| 摘要 |
PROBLEM TO BE SOLVED: To propose a conveyance mechanism for a substrate material, wherein: in the first place, smooth and stable conveyance of the substrate material is realized; second, a conveyance tool to the substrate material such as a leading board is not used; third, an error in precision of a resin roller can be coped with; fourth, contact between rollers is improved; fifth, the above can be simply, easily, correctly and surely realized; and sixth, also treatment accuracy can be maintained. SOLUTION: The conveyance mechanism 6 is used in the surface treatment apparatus 5 of a substrate material A during the manufacturing process of a circuit substrate; and has rollers 8 and 9, an intermediate charging board 24 and intermediate protrusions 25. The rollers 8 and 9 exhibit a straight roller form with numerous grooves 13 and 14, and the upper roller 8 consists of a free roller and an assembly of roller pieces. The intermediate charging board 24 is interposed between the front and rear rollers 8 and 9. Numerous intermediate protrusions 25 are attached to the board 24, and fit into and are in slide contact with the grooves 13 and 14 of the rollers 8 and 9. In addition, an overlap roller is used. COPYRIGHT: (C)2006,JPO&NCIPI
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