| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin-sealing molding method for a semiconductor device 2 which does not generate cracking, chipping, etc., in the device 2, prevents the occurrence of resin burrs by the leakage of a resin in a part 6 of the device 2 to be exposed, and, in enough consideration of the thickness dispersion of the set device 2, can efficiently separate a resin molding 10 part in a molded resin-sealed substrate from the mold surface of a mold 14. <P>SOLUTION: When a part 6 of the semiconductor device 2 or a part 6 of a transparent material 8 in place of the device 2 is exposed, an adhesive film 3 having an elastic action, a resin burr preventing projection 7, a mold releasing film 17 which has a necessary number of layers and is formed from soft/hard members 27 and 28, and an elastic member 22 having an elastic action are selected and combined respectively for resin-sealing molding. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
