| 摘要 |
A method for testing a semiconductor device, is disclosed, which comprises detecting a defect in a semiconductor wafer having a plurality of chips on each of which a plurality of semiconductor elements are formed, to detect those of the chips which have a defect, and carrying out a fist electrical characteristics test to a first chip without defect, and a second electrical characteristics test which is more detailed than the first electrical characteristics test to a second chip having the defect.
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