发明名称 |
Semiconductor device with anchor type seal ring |
摘要 |
A semiconductor package seal ring including a plurality of insulating layers, a plurality of conductive runners each embedded in one of the insulating layers, and a plurality of conductive posts each contacting one of the conductive runners and extending through at least one of the insulating layers and at least partially through an opening in another one of the conductive runners. |
申请公布号 |
SG118228(A1) |
申请公布日期 |
2006.01.27 |
申请号 |
SG20040000600 |
申请日期 |
2004.02.11 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
KANG-CHENG LIN;TIEN-I BAO |
分类号 |
H01L23/00;H01L23/58;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|