| 摘要 |
FIELD: construction industry; adhesive composition structures. ^ SUBSTANCE: the invention is pertaining to the field of construction industry, in particular, to production of the adhesive composition used for bonding of products made out of resin-bonded chipboards and woodfibrerboards, refractory materials and ceramics and for reline of linings of thermal installations. The technical result of the invention is production of the adhesive composition obtaining the high operational characteristics and reduced curing time. The adhesive composition contains: alumochromephosphatic binding modified at the stage of the synthesis of 0.6-1.1 mass % methylureas of the general formula H2(OCH2)nNCON(CH2O)mH2 , where n=1; 2, m=1; 2, a curing acceleration agent; water and a fine-dispersive filler in the form of a combination including as its components a high-aluminous mortar, silicon and ceramic mass and in the capacity of the curing acceleration agent contains amine modifier AM-1, and the indicated filler includes the indicated components at the ratio accordingly 10-20:30-50:2-10, at the following shares of the components (in mass %): the indicated alumochromephosphatic binding - 15-28, the indicated curing acceleration agent - 0.5-5, the indicated filler - 55-75, water - the rest. ^ EFFECT: the invention insures production of the adhesive composition obtaining the high operational characteristics and reduced curing time. ^ 2 ex, 1 tbl |
