| 摘要 |
PROBLEM TO BE SOLVED: To provide a composition for forming films covering various kinds of base materials such as silicon, metals, glass, ceramics and plastics, excellent in heat resistance, covering properties, flatness, adhesion, flexibility, durability, stress cushioning properties, transparency,α-ray shielding ability, chemical resistance, weather resistance, electrical insulation properties and dielectric characteristic, to provide a method for forming films and using the composition, and to provide a method for processing the films. SOLUTION: The composition for forming films comprises an organic solvent solution containing polyimide having a specific alicyclic tetracarboxylic acid structure, the method for forming film is characterized by forming the polyimide film by coating the composition for forming film and evaporating the solvent, and the method for processing the film is characterized by applying a wet etching method using an aprotic polar organic solvent as the etchant to remove the polyimide film of unwanted parts. COPYRIGHT: (C)2006,JPO&NCIPI
|
