| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining method different from conventional ones, which makes it easy to remove a smear remained on the bottom face of a hole, which is formed in a machining object including a lamination structure of a conductive layer and a resin layer, and on whose bottom face the conductive layer is exposed. <P>SOLUTION: The laser beam machining method includes: a step (a), where a hole, whose bottom face reaches the conductive layer, is formed by irradiating the lamination structure of the conductive layer and the resin layer with a laser beam to remove the resin layer; a step (b), where the surface of the conductive layer is melted by irradiating the bottom face of the hole with a pulse laser beam having a pulse width of >100 ns and having an energy density per one pulse at the bottom face of the hole of≥1.5 J/cm<SP>2</SP>; and a step (c), where the smear remained on the bottom face of the hole is removed after the above step (b). <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
