SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PRODUCING SUBSTRATE AND PRODUCTION METHODS THEREFOR

摘要

A semiconductor device producing substrate (B) comprising a base material layer (51), an adhesion sheet (50) having an adhesive layer (52), and a plurality of independent conductors (20) on the adhesive layer (52). A semiconductor element (10) formed with electrodes (11) is fixed to the substrate (B), and top sides of the plurality of conductors (20) and the electrodes (11) of the semiconductor element (10) are electrically connected by wires (30). The semiconductor element (10), the wires (30) and the conductors (20) are sealed by a sealing resin (40). Each conductor (20) has projecting portions (20a) and the side surfaces (60a) of a conductor (20) are roughened to enhance the joining strength between a conductor (20) and the sealing resin (40).