Geformte optische Verbindung

摘要

A molded optical interconnect is provided. A plurality of electrical tracings is disposed thereon. An optical module having an optical surface and a photonic device are operably coupled to an interconnect substrate. A molded optical portion having a core region with a first end and a cladding region is positioned with the first end of the core region being adjacent to the optical surface of the integrated circuit to operably couple the first end of the core region to the optical surface of the integrated circuit.