发明名称 Bake system
摘要 Provided is a bake system. The bake system includes a heating plate having a heating plate having a substrate on an upper surface. A case is disposed below the heating plate to support the heating plate; a first cover is disposed above the heating plate and coupled to the case to form a chamber; and a second cover is disposed in the first cover, and directly above the substrate in the bake process for preventing heat convection on the substrate.
申请公布号 US2006011605(A1) 申请公布日期 2006.01.19
申请号 US20050156530 申请日期 2005.06.21
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE DONG-WOO;KIM TAE-GYU;LEE JIN-SUNG
分类号 F27B9/06;H01L21/324;F27B17/00;F27D5/00;H01L21/00 主分类号 F27B9/06
代理机构 代理人
主权项
地址