发明名称 |
Bake system |
摘要 |
Provided is a bake system. The bake system includes a heating plate having a heating plate having a substrate on an upper surface. A case is disposed below the heating plate to support the heating plate; a first cover is disposed above the heating plate and coupled to the case to form a chamber; and a second cover is disposed in the first cover, and directly above the substrate in the bake process for preventing heat convection on the substrate.
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申请公布号 |
US2006011605(A1) |
申请公布日期 |
2006.01.19 |
申请号 |
US20050156530 |
申请日期 |
2005.06.21 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE DONG-WOO;KIM TAE-GYU;LEE JIN-SUNG |
分类号 |
F27B9/06;H01L21/324;F27B17/00;F27D5/00;H01L21/00 |
主分类号 |
F27B9/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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