| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance adhesion between a semiconductor IC incorporated in a substrate and a member adjacent thereto. <P>SOLUTION: The substrate incorporating a semiconductor IC comprises a multilayer substrate 10 composed of resin layers 11-13, and the semiconductor IC 130 buried in the multilayer substrate 10 wherein the surface roughness (Ra) of the semiconductor IC 130 is set at 1 μm or larger on the rear surface thereof. Since the rear surface of the semiconductor IC 130 is roughened, adhesion is enhanced sharply between the semiconductor IC 130 and a member in contact therewith. Furthermore, the overall thickness of the substrate incorporating the semiconductor IC can be reduced sharply by employing the semiconductor IC which is made thin by polishing. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
