| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting diode assembly body using eutectic solder and a conductive thermosetting adhesive, and to provide a method for manufacturing the light-emitting diode assembly body, in a connection between the electrode of a flip-chip type light-emitting diode and a wiring formed on a submount. <P>SOLUTION: The light-emitting diode assembly body comprises the flip-chip type light-emitting diode; the submount in which the flip-chip type light-emitting diode is mounted; a number of openings; and a wiring board in which a wiring electrode, or the like for connecting each flip-chip type light-emitting diode is formed. A pair of wires are formed on the upper surface of the submount. A pair of electrodes in the flip-chip type light-emitting diode and a pair of wires in the submount are connected via eutectic solder. The electrode formed on the back near the opening and the wire formed on the upper surface of the submount are connected via the conductive thermosetting adhesive. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
