| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit module satisfying request for reduction in size. <P>SOLUTION: A semiconductor element 16, an imaging element 15 and a second passive element 18 are bonded to the surface of a mounting part 11B provided at the end of a flexible sheet 11. Furthermore, a circuit device 20 is bonded to the rear surface of the mounting part 11B. The circuit device 20 incorporates a first passive element 22 consisting of a relatively large capacitor, or the like. Since a large chip element is incorporated in the circuit device 20, the whole module can be reduced in size. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
