| 发明名称 |
Semiconductor wafer production, used in electronics and microelectronics, comprises separating a semiconductor wafer from a single crystal, mechanically processing the wafer, etching, fine grinding and polishing |
| 摘要 |
<p>Production of a semiconductor wafer comprises separating a semiconductor wafer from a single crystal, mechanically processing the wafer, etching, fine grinding and polishing.</p> |
| 申请公布号 |
DE102004031966(A1) |
申请公布日期 |
2006.01.19 |
| 申请号 |
DE20041031966 |
申请日期 |
2004.07.01 |
| 申请人 |
SILTRONIC AG |
发明人 |
HUBER, ANTON;WEBER, CHRISTOF |
| 分类号 |
B28D1/00;B28D5/00;H01L21/302;H01L21/304 |
主分类号 |
B28D1/00 |
| 代理机构 |
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