| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device with which a quantity of defects are prevented from occurring and throughput can be improved. SOLUTION: Preceding work or the like is performed using a wafer cassette 10 comprising an IC card 11. In this case, processing contents and a processing result for the unit of a wafer are stored on the IC card 11, photo-lithography is performed on three wafers based on the processing contents. Operation from etching to the wafer of a slot No1 to an appearance check is then performed by the preceding work without performing lot division. If there is no problem in a result of this preceding work, operation from etching to wafers of slot No2 and No3 to the appearance check is then performed. COPYRIGHT: (C)2006,JPO&NCIPI
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