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发明名称
贴付剂
摘要
本发明之贴附剂,系在含有织布或是不织布的支撑体的表面具有黏着基剂,该黏着基剂系被展开使均匀被覆在该织布或是不织布上,藉由静电进行之带电性试验(依照JIS L1094规定),该织布或是不织布具有-50V~-4000V之带电压。因此,可获得制造效率高而且黏着基剂与支撑体之间具有充分黏附性的贴附剂。
申请公布号
TW200602007
申请公布日期
2006.01.16
申请号
TW094109842
申请日期
2005.03.29
申请人
久光制药股份有限公司
发明人
桥本好明;高田恭宪;鹤田清美
分类号
A61F13/02;A61K9/70;A61K45/00;A61P29/00
主分类号
A61F13/02
代理机构
代理人
蔡坤财
主权项
地址
日本
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