| 摘要 |
To mount semiconductor chips ( 3 ), the chips are placed in a liquid ( 5 ), and drops ( 51 ) of the liquid containing no more than one semiconductor chip are positioned on a substrate ( 2 ). On the substrate are molecules of a first type ( 1 ), on the semiconductor chips ( 3 ) are molecules of a second type ( 4 ) which can bond with the molecules of the first type ( 1 ). After the liquid ( 5 ) dries, the semiconductor chip ( 3 ) can be electrically contacted on the substrate ( 2 ) by conductive structures ( 21 ).
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