| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting device 11 improved in thermal conductivity from a light emitting diode 21 to a substrate 25 and, in addition, is reduced in thermal effect upon a resin component provided on the substrate 25 at the time of mounting the diode 21 on the substrate 25. <P>SOLUTION: After the light emitting diode 21 is mounted on a sub-mount 31 having an area larger than that of the diode 21 and high thermal conductivity, the sub-mount 31 is mounted on the substrate 25. On the substrate 25, a resin-made reflecting body 40 having a housing section 41 for housing the diode 21 is provided and a visible light converting resin layer 45 is packed in the housing section 41. The heat radiating property of the light emitting device is improved by efficiently transmitting the heat of the diode 21 to the sub-mount 31 and, at the same time, from the sub-mount 31 to the substrate 25 or visible light converting resin layer 45 by diffusion. The light emitting diode 21 is mounted on the sub-mount 31 by using an eutectic alloy 32 having high thermal conductivity. Then the sub-mount 31 having the light emitting diode 21 mounted on its surface is mounted on the substrate 25 by using silver paste 33 having a melting point lower than that of the eutectic alloy 32. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
