| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad for chemicomechanical polishing of a semiconductor wafer that does not cause scratches due to separating of an abrasive particle from a polishing pad during polishing. <P>SOLUTION: The polishing pad 10 comprises a body 11, a molecular binding link 30, and substantially uniformly dispersed abrasive particles 20 over the whole body. The body 11 is manufactured from a polymeric matrix material 12, and the molecular binding link 30 is convalently bonded to the matrix material 12. Substantially all abrasive particles 20 are convalently bonded to at least one molecular binding link 30. In the molecular binding link 30, the abrasive particles 20 are surely fixed to the matrix material 12, and thus the distribution uniformity of the abrasive particles 20 over the whole body of the pad is increased, to prevent the abrasive particles 20 from substantially separating from the pad. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
