发明名称 FILM PATTERN FORMING METHOD AND FILM PATTERN FORMING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a film pattern forming method capable of applying functional liquid as droplets and forming a finer film pattern, and to provide a film pattern forming apparatus using the film pattern forming method. SOLUTION: The film pattern forming apparatus is provided with a droplet delivery head 20 as a droplet delivery part for delivering functional liquid as droplets 60 to a film forming region 51 having liquid flow paths 53 which become the film pattern formed on a substrate W, a mounting stand 4 which mounts the substrate W thereon and has floating electrodes 40 as electrodes which are arranged in matrix at an interval and a voltage generating part 9 for generating a high voltage. The voltage generating part 9 is located correspondingly to the film forming region 51 of the substrate W mounted on the mounting stand 4 and performs discharging between the floating electrodes 40 successively grounded with GND (ground) and the same by means of a switching means 42. Thereby, an electrostatic force is applied to the functional liquid delivered to a liquid reception part 52 as droplets to spread wide along the liquid flow paths 53. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006007061(A) 申请公布日期 2006.01.12
申请号 JP20040186357 申请日期 2004.06.24
申请人 SEIKO EPSON CORP 发明人 JITSUKATA TAKAHITO
分类号 B05D1/26;B05C5/00;B05C9/12;B05D5/00 主分类号 B05D1/26
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