SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

A semiconductor device (1) and a method of producing the same are provided. The semiconductor device includes: a semiconductor chip (2); a resin package (3) which seals the semiconductor chip; signal passages which guide the signal terminals of the semiconductor chip outward from the resin package; a grounding metal film (8) in contact with the bottom surface of the semiconductor chip; and a grounding passage which is connected to the grounding metal ilm and guided outward from the resin package.