METHOD OF MANUFACTURING INTEGRATED CIRCUIT CHIP, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce difficulties in cutting a semiconductor region into chips or packaging it accompanying the reduction in thickness of the semiconductor region wherein an integrated circuit is formed. SOLUTION: A method of manufacturing an integrated circuit chip comprises a first bonding process wherein a first support member 150 is bonded to the first surface of a semiconductor substrate which has a first and a second surface, and has the semiconductor region 120 containing the integrated circuit on the first surface side; a thinning process wherein the semiconductor substrate is thinned by removing the second surface side of the semiconductor substrate with the first support member 150 bonded to the first surface, so that the semiconductor region 120 may be left over; a second bonding process wherein a second support member 170 is bonded to the second surface side of the thinned semiconductor substrate; and a process of cutting the semiconductor region 120 into individual chips. COPYRIGHT: (C)2006,JPO&NCIPI