| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy compound that has low viscosity, provides a cured material having low stress and excellent adhesivity and is suitable as an electric/electronic device material such as a semiconductor sealing material, an underfiller, etc., and a thermosetting resin composition. SOLUTION: The epoxy compound is obtained by hydrolyzing an alkoxy-silicon compound represented by general formula (1) XSi(OR<SP>1</SP>)<SB>3</SB>(X is an epoxy group-containing organic group; R<SP>1</SP>is a 1-4C alkyl group) and an alkoxy-silicon compound represented by general formula (2) XaR<SP>2</SP><SB>2-a</SB>Si(OR<SP>3</SP>)<SB>2</SB>(X is an epoxy group-containing organic group; R<SP>2</SP>is a 1-10C alkyl group or the like; a is an integer of 1 or 2) through condensation. The thermoplastic resin composition comprises the epoxy compound and a curing agent. COPYRIGHT: (C)2006,JPO&NCIPI
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