| 摘要 |
A multilayer leadframe module with embedded passive components and method of fabricating the same. The leadframe, comprising opposite first and second surfaces, includes an active device base exposed on the first and second surfaces, a trace line, exposed on the first surface, beyond the active device base, a contact pad, exposed at least on the second surface, beyond the trace line, a wiring layer, comprising a passive device, between the first and second surfaces and electrically connecting the trace line and contact pad, and an insulating material among the active device, trace line, contact pad, and the wiring layer, and completely covering the wiring layer.
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