| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for processing a substrate capable of consistently depositing a protective film by the electroless plating on a surface of a wire formed by CMP (chemical and mechanical polishing) without degrading the wiring reliability, and increasing the throughput. SOLUTION: A substrate is prepared, in which a wiring recess is formed in the surface, and film deposition is performed while a wiring material is embedded in the wiring recess, excessive wiring material other than that in the recess is removed by the chemical and mechanical polishing, and the wiring material in the recess is formed into a wire. The surface of the substrate is brought into contact with a cleaning solution immediately after the polishing to remove polishing residue and an oxide film on the surface of the wire, the surface of the substrate brought into contact with cleaning solution is brought into contact with a catalyst processing solution to provide a catalyst on the surface of the wire, and the surface of the substrate with the catalyst provided thereon is cleaned and dried. COPYRIGHT: (C)2006,JPO&NCIPI
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