| 摘要 |
An audio enhancement apparatus includes a thermally insulating container and a substrate mounted at least partially within the thermally insulating container. A heat source is provided within the thermally insulating container and proximate to the substrate. At least one audio semiconductor is mounted to the substrate, where the audio semiconductor is located within the thermally insulating container. The thermally insulating container, in conjunction with the heat source, maintains an above-ambient temperature for the audio semiconductor while at least partially insulating components located outside of the thermally insulating container from the heat source. Another embodiment of the audio enhancement apparatus includes a thermally conductive substrate with at least one heat source located proximate to the substrate and at least one audio semiconductor mounted to the substrate. A heat dissipation device is also mounted proximate to the substrate.
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