| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor exposure apparatus capable of reducing adverse influence of thermal strain by minimizing the temperature difference between a refrigerant entrance and a refrigerant exit of a heat generating body against the heating value of the heat generating body, and further improving follow-up performance. <P>SOLUTION: The semiconductor exposure apparatus is equipped with a means of performing temperature control so that the refrigerant entrance temperature of the heat generating body is always constant, a means for detecting the refrigerant exit temperature of the heat generating body, and a means for adjusting the refrigerant flow rate to keep the refrigerant exit temperature of the heat generating body within a certain fixed range, and is controlled to make the temperature difference between the refrigerant entrance and exit constant. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
