| 摘要 |
PROBLEM TO BE SOLVED: To obtain high metal joining strength without removing a resin insulating layer at least at the terminal of an FPC when the terminal of the FPC and the terminal of another wiring board joined together with metal by an ultrasonic joining method. SOLUTION: After the terminal of the FPC and the terminal of the other wiring substrate are put one over the other, the terminals are joined together with metal. In this the ultrasonic joining method, at least the resin insulating layer of the terminal of the FPC is irradiated with laser light simultaneously with the ultrasonic joining. COPYRIGHT: (C)2006,JPO&NCIPI
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