发明名称 |
Contact pad identification |
摘要 |
The present invention includes a system for and a method of identifying the location of contact pads on interconnect layers of printed circuit boards or metal layers of integrated circuits. The invention groups the conductive surfaces into rectangular areas and applies a mask to the identified rectangular areas by aligning a corner of the mask with the corresponding corner of the rectangular area. Once aligned, the remaining corners of the mask are checked to see whether there is an underlying conductive material present at all corners thereby identifying a suitable location for a contact pad. The invention further includes an alignment of alternate corners of the mask with the corresponding corner of the rectangular area if previous attempts to identify a contact pad were unsuccessful. |
申请公布号 |
GB2379532(B) |
申请公布日期 |
2006.01.11 |
申请号 |
GB20020011954 |
申请日期 |
2002.05.23 |
申请人 |
HEWLETT-PACKARD COMPANY;HEWLETT-PACKARD COMPANY |
发明人 |
DAVID C BURDEN |
分类号 |
G06F17/50;G06F9/45;H01L23/498 |
主分类号 |
G06F17/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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