| 摘要 |
A method of manufacturing a light-emitting diode (LED) device includes forming a lead frame having a first pattern part mounted with an LED chip, a second pattern part electrically connected to the first pattern part to be used as an electrode, a third pattern part spaced from the first pattern part to be electrically insulated from the first pattern part and used as another electrode, and a fourth pattern part and a fifth pattern part integrated with both sides of the first pattern part, forming a layer plated with a metal having high reflectivity on the fourth and fifth pattern parts, and upwardly folding the fourth and fifth pattern parts to be perpendicular to the first pattern part to form reflective surfaces. |
