发明名称 |
System and method for monitoring the topography of a wafer surface during lithographic processing |
摘要 |
A system for monitoring wafer surface topography during a lithographic process is described that includes projection optics that illuminate a portion of the wafer surface. The system further includes at least one off-axis wafer surface gauge that monitors wafer surface height relative to the projection optics as well as at least one backplane gauge that monitors wafer position relative to a backplane. The system also includes a filter that translates time-domain measurements of off-axis wafer surface gauge and the backplane gauge into space-domain measurements. A coordinate transformer is included that transforms the space-domain measurements into a single coordinate system. A computational element that combines the space-domain measurements with a focus set-point to determine correction data is also included together with a delay line for storing the correction data until the wafer has moved a predetermined distance.
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申请公布号 |
US6984836(B2) |
申请公布日期 |
2006.01.10 |
申请号 |
US20030435562 |
申请日期 |
2003.05.12 |
申请人 |
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发明人 |
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分类号 |
G01J1/20;G01N21/86;G03F9/00;H01L21/00;H01L21/68 |
主分类号 |
G01J1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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