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发明名称
Substrate for manufacturing semiconductor package
摘要
申请公布号
KR100541499(B1)
申请公布日期
2006.01.10
申请号
KR20030058386
申请日期
2003.08.22
申请人
发明人
分类号
H01L23/28
主分类号
H01L23/28
代理机构
代理人
主权项
地址
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