| 摘要 |
A resin composition for sealing a semiconductor, which comprises a phenol aralkyl type epoxy resin having a biphenylene skeleton (A), a phenol aralkyl resin having a phenylene skeleton or biphenylene skeleton (B), an inorganic filler (C) in an amount of 84 to 90 wt % and a curing accelerator (D), as main components, and further comprises a silane coupling agent (E) in an amount of 0.01 wt % to 1 wt % and an aromatic compound (F) having two or more hydroxyl groups bonded to adjacent carbon atoms in an aromatic ring in an amount of 0.01 wt % or more, the percentages being relative to the total amount of the resin composition. The resin composition exhibits improved flowability, without detriment to its curability. |
